Product Positioning
With the miniaturization of 3C electronics and popularization of SiP advanced packaging, ultra-thin wafer thinning (below 100μm), backside fine grinding and post-CMP lapping have become core semiconductor processes. Anchor wafer grinding wheels are developed for hard-brittle Si, SiC, GaN wafers, compatible with mainstream grinders including DISCO, Okamoto, ACCRETECH. It delivers mass grinding solutions with stable thickness control, ultra-low damage layer and superior consistency for power devices, RF chips and MEMS.
Core Product Advantages
- Precise Thickness & TTV Control
Uniformly distributed abrasives deliver minimal fluctuation of material removal rate during continuous grinding, stably controlling wafer thickness uniformity and lowering processing burden of subsequent polishing & etching steps.
- Low Scratch & Edge Chipping
Optimized special resin/ceramic bond formula holds abrasives firmly without massive grit shedding, greatly cutting wafer surface scratches and edge breakage to raise finished wafer yield.
- Adaptable to Hard-Brittle Semiconductors
Compatible with Si, SiC, GaN wafers, balancing high removal efficiency for rough grinding and mirror finish for fine lapping, ideal for high-end new energy power devices & RF high-frequency chips.
- Stable Mass Production Performance
Grinding load fluctuates gently under long-hour continuous operation with infrequent wheel dressing, suitable for 24/7 fab production lines and boosting daily machine output.
- Multi-Stage Process Matching
Two grit series (Z1 rough grinding, Z2 fine grinding) cover rough stock removal, mirror finishing and ultra-fine polishing. Customers can select proper specs based on target Ra surface roughness.
Applicable Grinding Processes
- Silicon wafer backside thinning grinding
- Rough & mirror fine grinding for SiC/GaN power wafers
- Precision post-CMP lapping process
- Ultra-thin wafer processing for MEMS & RF chips
- Wafer thinning for SiP advanced packaging
Standard Specification Parameters
| Abrasive | Grit Range | Hardness Grade | Concentration | Bond Type | Standard Profile |
| SD / SDC | #320 ~ #15000 | N | 50 / 75 / 100 / 125 | B / V / M | 2A2S / 2A7S |
Common Wafer Sizes: 8″ (203mm), 10″ (250mm), 12″ (300/303mm)
Compatible Equipment: DISCO, Okamoto, ACCRETECH wafer grinders
Actual Customer Test Case
| Category | Item | Original Factory Wheel | Anchor Wafer Wheel |
|---|---|---|---|
| Basic Conditions | Wheel Spec | — | 300D × 4W × 5X |
| Workpiece | 12″ Silicon Wafer | 12″ Silicon Wafer | |
| Machine Model | Disco DAG810 | Disco DAG810 | |
| Process Parameters | Spindle Speed | 2400 / 240 rpm | 2400 / 240 rpm |
| Feed Rate | 3.0 / 2.5 / 1.0 μm/s | 3.0 / 2.5 / 1.0 μm/s | |
| Test Results | Grinding Load | 14.6 A | 14.7 A (Comparable) |
| Average Ra | 0.22 | 0.18 (Better) | |
| Wear Ratio (Workpiece/Wheel) | — | 200 | |
| Surface Scratches | Micro scratches visible | No visible micro scratches | |
| Surface Finish | Standard | Significantly better |
Conclusion: Under identical parameters, Anchor wheel delivers comparable load, lower Ra, higher wear ratio and scratch-free surface — overall superior grinding performance.
Customization Service Instruction
Customization available for outer diameter, thickness, bore, grit, abrasive concentration and special wheel profiles. We provide sample grinding tests for ultra-thin wafers of special materials, strict roughness requirements and niche imported grinders, offering exclusive process solutions and quotations.
